You are invited to present 2023 8th International Conference on Intelligent Computing and Signal Processing (ICSP 2023) will be held during April 21-23, 2023 in Xi'an, China. It's sponsored by Xi'an Shiyou University, China.
As a leading role in the global megatrend of scientific innovation, China has been creating a more and more open environment for scientific innovation, increasing the depth and breadth of academic cooperation, and building a community of innovation that benefits all. These endeavors have made new contribution to globalization and creating a community of shared future.
To adapt to this changing world and China’s fast development in this new era, the2023 8th International Conference on Intelligent Computing and Signal Processing (ICSP 2023) takes “Intelligent Computing and Signal Processing” as the theme and focuses on cutting-edge research fields including Intelligent Computing and Machine Learning, Signal Processing and Intelligent Control, Image Processing and Computer Vision, Internet of Things and Sensor Technology. This conference aims to boost development of the Computer Area, expand channels of international academic exchange in science and technology, build a sharing platform of academic resources, promote scientific innovation on the global scale, improve academic cooperation between China and the outside world, enhance development of Intelligent Computing and Signal Processing industries. It also aims to encourage exchange of information on research frontiers in different fields, connect the most advanced academic resources in China and abroad, turn research results into industrial solutions, bring together talents, technologies and capital to boost development.
Full Paper Submission Date: February 22, 2023
Notification of Acceptance Date: March 22, 2023
Final Paper Submission Date: April 06, 2023
Alberto Del Bimbo
ACM Distinguished Scientist, Chair of ACM SIGMM, IAPR Fellow, University of Firenze, Italy
IEEE Fellow, Zhejiang Lab, China
IEEE Fellow，Xi'an Jiaotong University/School of Mechanical Engineering, China
IET Fellow, IETE Fellow, IACSIT Fellow, Distinguish speaker of IEEE Computer Society, Noroff University College, Norway
IEEE Fellow, University of Sydney, Australia
IEEE Fellow, University of Science and Technology Beijing, China
University of Electronic Science and Technology of China, China
The University of Hong Kong (HKU), China
Submitted papers will be peer reviewed by conference committees. Accepted papers will be included in ICSP 2023 Conference Proceedings.
All papers, both invited and contributed, the accepted papers, will be published and submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore's scope and quality requirements, and also submitted to EI Compendex and Scopus for indexing. All conference proceedings paper can not be less than 4 pages.
ICSP 2023 has been approved by IEEE and being online on IEEE conference search (click)
Paper submissions will also be peer reviewed and evaluated based on originality, technical and/or research content/depth, correctness, relevance to conference, contributions, and readability. Authors are invited to submit papers describing original research work in areas including but not limited to:
Automated Software Engineering
Bioinformatics and Scientific Computing
Compilers and Interpreters
Computer Architecture and Embedded Systems
Computer Graphics and Multimedia、
ICSP 2022 Proceedings |IEEE Xplore | ISBN: 978-1-6654-7856-4 | Ei Compendex & Scopus Index
ICSP 2021 Proceedings | IEEE Xplore | ISBN: 978-0-7381-4369-9 | Ei Compendex & Scopus Index
ICSP 2020 Proceedings| ISSN: 1742-6588 | Ei Compendex & Scopus Index
ICSP 2019 Proceedings | ISSN: 1742-6588 | Ei Compendex & Scopus Index
ICSP 2018 Proceedings | ISSN: 2261-236X | Ei Compendex & Scopus Index
ICSP 2017 Proceedings |ISSN: 1755-1307 | Ei Compendex & Scopus Index