| About STIE 2026 2026 International Conference on Sensor Technology and Information Engineering (STIE 2026) Website: www.ic-stie.com Date: April 17-19,2026 Venue: Hefei, China
As a parallel session of the 11th International Conference on Intelligent Computing and Signal Processing (ICSP 2026), STIE 2026 will be held in Hefei, China from April 17 to 19,2026. This conference aims to bring together experts, scholars, researchers and industry elites from academia and industry at home and abroad to conduct extensive and in-depth discussions on cutting-edge exploration, design innovation, system integration and future prospects in the field of sensor technology and information engineering. We sincerely welcome scholars, engineers and industry representatives from all over the world who are engaged in related research to participate in the conference, share their insights, exchange innovative practices, jointly promote the interdisciplinary integration and coordinated development of sensor technology and information engineering disciplines, and contribute wisdom to the intelligent upgrading of the enabling industry and the prosperity of the digital economy. |
Submission Link: 
Registration Link:Publication
Submit to Conference Proceedings (EI)
All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted papers of STIE 2026 will be published in SPIE - The International Society for Optical Engineering (ISSN: 0277-786X) and will be submitted to EI Compendex / Scopus for indexing.
Call For Paper
The topics of interest for submission include, but are not limited to:
◕Sensor Technology and Application New Material Sensor Flexible and Wearable Sensor Technology Physical / Chemical / Biological Sensors Intelligent Sensors and Systems Micro-Electro-Mechanical System (MEMS) and Nano-Electro-Mechanical System (NEMS) Technology Chip-Level Sensor Quantum Sensing and Precision Measurement Low Power Consumption and Self-Powered Miniaturization and Integration Bio-Inspired Sensing and Biological Compatibility Optics and Imaging Sensing | ◕ Wireless Sensor Network and Internet of Things Technology Wireless Sensor Networks Communication Technology and Systems Artificial Intelligence Internet of Things Network Topology Optimization Information Security and Cryptography Construction of a Distributed Sensing System Sensing Communication Protocol Sensor Network Management Internet of Vehicles Cross-Platform Data Interface |
◕ Sensors and Information Engineering Applications Industrial Automation Environmental and Safety Monitoring Aerospace Sensing Technology Consumer Electronics Intelligent Sensing Energy System Condition Monitoring Biomedical Electronics and Sensing Multiple Sensor Integration Smart Agriculture Measurement and Control Predictive Maintenance Intelligent Transportation Smart Home | ◕ Sensor Signal Processing and Intelligent Information Fusion Signal Filtering and Noise Reduction Cloud Computing and Edge Algorithm Deep Learning Brain-Like Computing Data Feature Extraction and Recognition Real-Time Signal Processing and Decision Making Multimodal, Heterogeneous Integration Sensing Data Compression and Transmission Coding Vision and Radar Sensing Information Fusion Quality Control Information Complementation Data Fusion Algorithm |
Registration
| Items | Registration Fee |
| Regular Registration for Paper | 515 USD/per paper (4-6 pages) 3600RMB/per paper (4-6 pages) |
Early bird Registration for Paper (4-6 pages) 【Before March 03, 2026】 | 460 USD/per paper (4-6 pages) 3200RMB/per paper (4-6 pages) |
| Student Registration for Paper(4-6 pages) | 485 USD/per paper (4-6 pages) 3400RMB/per paper (4-6 pages) |
| Extra Pages (Begin at Page 7) | 55 USD/ per extra page 400RMB/per extra page |
| Attendees without a Submission | 170 USD / per person 1200RMB/per person |
| Attendees without a Submission (Groups） | 140 USD / per person (≥ 3 persons) 1000RMB/per person (≥ 3 persons) |
| Purchase Extra Proceedings/Journal copies | 70 USD/book 500 CNY/book |
For further details, please visit the official website.